Printed circuit board including embedded capacitors and method of manufacturing the same

ABSTRACT

Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

INCORPORATION BY REFERENCE

The present application claims priority under 35 U.S.C. §119 to KoreanPatent Application Nos. 2004-64291 filed on Aug. 16, 2004 and2004-104210 filed Dec. 10, 2004. The content of the applications areincorporated herein by reference in their entireties.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a printed circuit board (PCB)in which a condenser laminate or a capacitor is embedded. Morespecifically, the present invention relates to a PCB including embeddedpolymer condenser laminates, which is capable of manifesting highercapacitance density per unit area than conventional PCBs includingembedded capacitors, so that capacitors having various capacitancevalues, for example, multilayered ceramic capacitors (MLCCs) having highcapacitance, can be embedded in the PCB, instead of being mounted on thePCB; and a method of manufacturing the same.

2. Description of the Related Art

In general, capacitors store energy in the form of an electric field.When a DC voltage source is applied to a capacitor, the capacitor ischarged but the current flow stops. On the other hand, if an AC voltagesource is connected to a capacitor, the current flows through thecapacitor depending on the frequency of the applied AC signal and thevalue of the capacitor while the capacitor is charged and discharged.

Thus, the capacitor having the above properties acts as a passivecomponent essential for use in a variety of purposes, for example,coupling and decoupling, filters, impedance matching, charge pumps anddemodulation in electric and electronic circuits, such as digitalcircuits, analog circuits and high frequency circuits. Further, thecapacitors, which are manufactured in various forms, such as chips ordiscs, have been used in the state of being mounted on PCBs.

However, miniaturization and complication of the electronic devices leadto reducing the areas for mounting the passive components on the PCB.Also, while frequencies become higher in accordance with high speedelectronic devices, parasitic impedance is generated by the conductor,solder, etc., between the passive component and the IC, thus causingseveral problems. To solve the problems, various attempts have been madeto embed the capacitor in the PCB, mainly led by the manufacturers ofPCBs and electric and electronic components.

Although discrete chip resistors or discrete chip capacitors have longsince been mounted on PCBs, PCBs including embedded passive componentssuch as resistors or capacitors have only been recently developed.

In techniques of manufacturing PCBs including embedded passivecomponents, passive components such as resistors or capacitors areprovided in PCBs using novel materials and processes, to substitute forconventional chip resistors and chip capacitors. That is, the PCBincluding embedded passive components means that the passive component,for example, capacitor, is embedded in the inner layer of the PCB.Regardless of the size of the PCB itself, if the capacitor as thepassive component is incorporated in the PCB, this is called an‘embedded capacitor’. Such a substrate is referred to as an embeddedcapacitor PCB. The major characteristic of the embedded capacitor PCB isthat the capacitor is intrinsically provided in the PCB without the needto mount the capacitor on the PCB.

FIGS. 1 a to 1 e show a conventional process of manufacturing a PCBincluding embedded polymer film type capacitors, in which a polymercapacitor paste is applied on a substrate and then hot dried (or cured),to realize the PCB including the embedded polymer film type capacitor.

In a first step, a copper foil layer of an inner layer 41 of the PCBcomprising a FR-4 reinforced base sheet 42 is coated with a dry film,followed by being exposed and developed. Then, the copper foil layer isetched to form anodic copper foils 44 a and 44 b, cathodic copper foils43 a and 43 b, and spaces therebetween (FIG. 1 a).

In a second step, capacitor pastes 45 a and 45 b composed of a polymerthat contains ceramic powder having a high dielectric constant areapplied on the cathodic copper foils 43 a and 43 b by a screen printingprocess, and then dried or cured (FIG. 1 b). Herein, the screen printingis performed by applying a media such as ink on a stencil screen using asqueeze, thereby transferring a pattern to a substrate.

At this step, the spaces between the anodic copper foils 44 a and 44 band the cathodic copper foils 43 a and 43 b are covered with thecapacitor pastes 45 a and 45 b.

In a third step, a conductive paste including silver or copper is formedinto anodes 46 a and 46 b using a screen printing process, and dried orcured (FIG. 1 c).

In a fourth step, the capacitor layer subjected to first to third stepsof the inner layer 41 of the PCB is inserted between insulating layers47 a and 47 b, followed by being laminated (FIG. 1 d).

In a fifth step, a through hole and laser blind via holes 49 a and 49 bare formed through the laminate, whereby the capacitor present in theinner layer of the PCB is connected to positive terminals 51 a and 51 band negative terminals 50 a and 50 b of IC chips 52 a and 52 b mountedoutside the PCB, thus acting as an embedded capacitor (FIG. 1 e).

Likewise, there are disclosed methods of manufacturing the embeddeddiscrete type capacitor by coating the PCB with a ceramic filledphotosensitive resin, which have been patented by Motorola Co. Ltd.,USA. The above method comprises applying the photosensitive resincontaining ceramic powder on the substrate, laminating copper foil onthe resin layer to form upper electrodes and lower electrodes, forming acircuit pattern, and then etching the photosensitive resin, to realizethe discrete capacitor.

Further, there are proposed methods of fabricating the embeddedcapacitor by separately including a dielectric layer having capacitanceproperties in the inner layer of the PCB, so as to be used instead of adecoupling capacitor mounted on the PCB, which have been patented bySanmina Co. Ltd., USA. In this method, the dielectric layer comprisingpower electrodes and ground electrodes is incorporated in the innerlayer of the PCB, to obtain a power distributed decoupling capacitor.

Various processes are under study to achieve the above techniques, inwhich methods of embodying each process vary.

In this regard, U.S. Pat. No. 5,079,069 granted to Howard et al.discloses a capacitor laminate for use in capacitive printed circuitboards and methods of manufacture, in which the concept of ‘borrowedcapacitor’is used, to manufacture the PCB comprising the laminatedcapacitor as a structurally rigid assembly formed of sheets ofconductive material and an intermediate sheet of dielectric material,which is in operative connection with a large number of devices.

Also, U.S. Pat. No. 5,010,641 granted to Sisler et al. discloses amethod of making a multilayer printed circuit board to eliminate theneed for the by-pass capacitor by providing one or more fully curedpower-ground plane sandwich components which are laminated together withother partially cured component layers of the board and circuitpattern-formed components.

In the embedded capacitor PCBs according to the conventional techniques,the chip type capacitor is embedded in the portion of the PCB, or thesingular sheet type dielectric layer is inserted between the layersconstituting the PCB.

However, the embedded capacitor PCBs manufactured by the abovetechniques have capacitance density of 0.5 to 3 nF per inch, which is aninsufficient value to completely embed the capacitor in the PCB.Moreover, limitations are imposed on reduction of the mounting area ofthe passive component.

Therefore, there are required novel techniques of embedding high densitycapacitors, such as MLCCs, which are mounted on the PCB but not embeddedtherein at present, in the PCBs, by realizing higher capacitance densityper unit area than conventional embedded capacitor PCBs.

SUMMARY OF THE INVENTION

Accordingly, the present invention has been made keeping in mind theabove problems occurring in the related art, and an object of thepresent invention is to provide a PCB including embedded capacitors inwhich a dielectric laminate is incorporated, and a method ofmanufacturing the same.

Another object of the present invention is to provide a PCB includingembedded capacitors which exhibits higher capacitance density thanconventional embedded capacitor PCBs, and a method of manufacturing thesame.

Still another object of the present invention is to provide a PCBincluding embedded capacitors in which an area for mounting passivecomponents is drastically reduced, and a method of manufacturing thesame.

A further object of the present invention is to provide a PCB includingembedded capacitors in which the capacitor can be desirably designed sothat various capacitance values can be realized in a PCB having limitedthickness, and a method of manufacturing the same.

In order to accomplish the above objects, according to a first aspect ofthe present invention, a method of manufacturing a PCB includingembedded capacitors is provided, the method comprising forming a polymercondenser laminate including a plurality of polymer condenser layers,each of which has a polymer sheet having a high dielectric constant anda conductor pattern formed on the polymer sheet; forming a via hole forinterlayer connection through a double sided CCL and a circuit patternon the double sided CCL, to prepare a patterned CCL; layering thepatterned CCL on either surface of the polymer condenser laminate; andforming a via hole through the polymer condenser laminate and a circuitpattern on the polymer condenser laminate.

According to a second aspect of the present invention, a method ofmanufacturing a PCB including embedded capacitors is provided, themethod comprising forming a polymer condenser laminate including aplurality of polymer condenser layers, each of which has a polymer sheethaving a high dielectric constant and a conductor pattern formed on thepolymer sheet; forming a via hole through the polymer condenserlaminate; filling the via hole by plating and forming a circuit pattern;forming a via hole through a double sided CCL and a circuit pattern onthe double sided CCL, to prepare a patterned CCL; layering an insulatinglayer on either surface or both surfaces of the polymer condenserlaminate; layering the patterned CCL on the insulating layer; forming avia hole for interlayer electrical connection through the PCB; andfilling the via hole by plating and forming a circuit pattern on thePCB.

Further, a PCB including embedded capacitors is provided, comprising apolymer condenser laminate including a plurality of polymer condenserlayers, each of which has a polymer sheet and a conductor pattern formedon the polymer sheet, and a via hole for interlayer connectiontherethrough; and a circuit pattern layer formed on either surface orboth surfaces of the polymer condenser laminate, and having a circuitpattern and a via hole for interlayer connection therethrough.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentinvention will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIGS. 1 a to 1 e are views showing a conventional process ofmanufacturing a PCB including embedded polymer film type capacitors;

FIGS. 2, 3 a, 3 b, 4, and 5 a to 5 d are views showing a process ofmanufacturing a PCB including embedded capacitors, according to anembodiment of the present invention;

FIGS. 6 a to 6 g are views showing a process of manufacturing a PCBincluding embedded capacitors, according to another embodiment of thepresent invention;

FIGS. 7 a to 7 d are views showing a process of manufacturing a PCBincluding embedded capacitors, according to a further embodiment of thepresent invention; and

FIGS. 8 a and 8 b are views showing a process of manufacturing a PCBincluding embedded capacitors, according to another embodiment of thepresent invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, a detailed description will be given of the presentinvention, with reference to the appended drawings.

FIGS. 2, 3 a, 3 b, 4, and 5 a to 5 d show a process of manufacturing aPCB including embedded capacitors, according to an embodiment of thepresent invention.

As shown in FIG. 2, a conductor 23, such as aluminum or copper, ispatterned into a predetermined pattern on a wide flat polymer sheet 22having a high dielectric constant, to form a polymer condenser layer 21.

The patterning method of the conductor 23 includes, for example, a dryprocess such as sputtering, and a wet process such as screen printing.

In FIG. 3 a, a first polymer condenser layer 21 a having a firstconductor pattern 23 a and a second polymer condenser layer 21 b havinga second conductor pattern 23 b are aligned and then laminated together.As is apparent from FIG. 3 a, the first and second conductor patterns 23a and 23 b of the first and second condenser layers 21 a and 21 b,respectively, are positioned to be relatively shifted with respect toeach other, therefore resulting in a laminated capacitor form. Althoughthe conductor patterns 23 a and 23 b shown in FIG. 3 a are shifted tothe left and right, they may be shifted up or down or in predetermineddirections.

Alternatively, the first conductor pattern 23 a, the second polymersheet 22 b, and the second conductor pattern 23 b, in order, may belayered on the first polymer sheet 22 a.

Further, although the layering process using the two polymer condenserlayers 21 a and 21 b is illustrated in FIG. 3 a, the number of polymercondenser layers to be laminated may be appropriately controlleddepending on required capacitance.

More specifically, capacitance varies with the area and thickness of thecapacitor, and is calculated by Equation 1, below: $\begin{matrix}{C = {ɛ_{r}{ɛ_{0}\left( \frac{A}{D} \right)}}} & {{Equation}\quad 1}\end{matrix}$

Wherein, ε_(r) is a dielectric constant of a dielectric material, and ε₀is a constant having a value of 8.855×10⁻⁸, and A is a surface area of adielectric material, and D is a thickness of a dielectric material. Thatis, to realize the capacitor having high capacitance, the dielectricmaterial should have a high dielectric constant. Also, as the thicknessof the dielectric material is reduced and the surface area thereof isincreased, the capacitor having higher capacitance can be obtained. Ifthe number of polymer condenser layers to be laminated increases, thesurface area of the dielectric material increases, and thus, thecapacitance increases. Meanwhile, if the number of polymer condenserlayers to be laminated decreases, a capacitor having low capacitance isobtained. Thus, in the present invention, the number of polymercondenser layers is adjusted to determine the capacitance of thecapacitor embedded in the PCB.

FIG. 3 b shows a cross-section of a polymer condenser laminate 31 havinga plurality of flat polymer condenser layers. The polymer condenserlaminate 31 resulting from lamination of the plurality of polymercondenser layers has a structure of the conductors 33 having apredetermined pattern inserted between the polymer sheets 32 having ahigh dielectric constant.

In FIG. 4, via holes 44 are formed at predetermined positions on a CCLsubstrate comprising an FR-4 reinforced base sheet 42 and copper foillayers on both surfaces thereof, by a laser drilling process or amechanical drilling process, and then filled by a plating process. Then,dry film is applied on both surfaces of the CCL substrate, followed bybeing exposed and developed. Subsequently, the copper foil layer isetched to form a circuit pattern 43, thereby preparing a patterned CCL41.

The circuit pattern 43 may be formed by any one process selected fromamong an etching process, a plating process and combinations thereof.Further, in addition to the FR-4 reinforced base sheet as the CCLsubstrate, any CCL substrate may be used so long as it includes amaterial appropriate for end uses of the PCB.

In FIG. 5 a, the polymer condenser laminate 31 of FIG. 3 b is layered onthe patterned CCL 41.

In FIG. 5 b, via holes 34 for interlayer connection are formed throughthe polymer condenser laminate 31, and are filled by a plating processor filler. Then, on the polymer condenser laminate 31, a copper foillayer is formed by a plating process, and then coated with a dry film,followed by being exposed and developed. Subsequently, the copper foillayer is etched to form a circuit pattern 35. The circuit pattern 35 maybe formed by any one process selected from among an etching process, aplating process and combinations thereof.

In FIG. 5 c, on the polymer condenser laminate 31, a single sided CCLsubstrate 51 including an insulating layer 52 and a copper foil layer53, for example, RCC (Resin Coated Copper), is layered.

In FIG. 5 d, via holes 54 are formed through the CCL substrate 51, afterwhich the copper foil layer of the CCL substrate 51 is coated with a dryfilm, followed by being exposed and developed. Then, the copper foillayer is etched, to form a desired circuit pattern 53.

As shown in FIG. 5 d, the PCB including embedded condensers according tothe above embodiment of the present invention has therein the polymercondenser laminate 31 composed of a dielectric material having a highdielectric constant.

FIGS. 6 a to 6 f show a process of manufacturing a PCB includingembedded capacitors, according to another embodiment of the presentinvention.

In FIG. 6 a, via holes 34 are drilled at predetermined positions on thepolymer condenser laminate 31 obtained by the process shown FIGS. 2, 3 aand 3 b. As such, it is preferable that a laser drilling process beperformed.

In FIG. 6 b, a photosensitive film is laminated on both surfaces of thepolymer condenser laminate 31, after which a mask having a predeterminedpattern is placed on the photosensitive film, followed by being exposed,to form a film pattern. Then, the film pattern is subjected toelectroless plating and electroplating, to obtain a circuit pattern 61.At the same time as the circuit pattern 61 is formed, the via holes 34are filled by plating.

While the polymer condenser laminate 31 is formed as mentioned above,patterned CCLs 62 a and 62 b having circuit patterns 63 a and 63 b,respectively, are prepared as in FIG. 6 c. The patterned CCLs 62 a and62 b can be obtained by forming a resist pattern for etching on bothsurfaces of CCLs, followed by being etched, or forming a resist patternfor plating thereon, followed by being plated, in which the CCLs includeinsulating layers 64 a and 64 b and copper foil layers formed on bothsurfaces thereof, respectively.

In FIG. 6 d, insulating layers for interlayer insulation, for example,prepregs 65 a and 65 b, are placed on both surfaces of the polymercondenser laminate 31 having via holes 34 as in FIG. 6 b, after whichthe patterned CCLs 62 a and 62 b are laid on the insulating layers 65 aand 65 b, followed by being compressed together.

In FIG. 6 e, through holes 66 a and 66 b are formed to electricallyconnect the circuit patterns 63 a and 63 b of the patterned CCLs 62 aand 62 b and the circuit patterns 61 formed on the polymer condenserlaminate 31. Then, the through holes 66 a and 66 b are filled with aconductive material by a plating process.

In FIG. 6 f, to layer a further circuit pattern layer, an insulatinglayer for interlayer insulation, for example, a prepreg, 65 c, and apatterned CCL 62 c are sequentially superimposed on a lower surface ofthe substrate shown in FIG. 6 e, followed by being compressed. Thepatterned CCL 62 c includes an insulating layer 64 c and circuitpatterns 63 c formed on both surfaces thereof.

In FIG. 6 g, through holes 66 c are laser-drilled to electricallyconnect the circuit patterns 63 c on the additionally layered CCL 62c tothe circuit patterns of the other layers. Also, a through hole 67 whichpasses completely through the substrate is laser-drilled. The throughholes 66 c and 67 are filled with a conductive filler by a platingprocess.

As shown in FIG. 6 g, the PCB including embedded condensers according tothe second embodiment of the present invention has the polymer condenserlaminate 31 composed of a dielectric material having a high dielectricconstant therein.

Although the process of forming the circuit pattern layers on bothsurfaces of the polymer condenser laminate 31 is illustrated in FIGS. 6a to 6 g, a further circuit pattern layer may be formed on only onesurface of the polymer condenser laminate 31, or as many prepregs andcircuit pattern layers as necessary may be additionally formed byrepeating the above process.

FIGS. 7 a to 7 d show a process of manufacturing a PCB includingembedded capacitors, according to a further embodiment of the presentinvention.

As in the above embodiments, in FIG. 7 a, conductor patterns 73 a and 73b made of aluminum or copper and having predetermined patterns areformed on wide flat polymer sheets 72 a and 72 b having high dielectricconstants, respectively, to prepare first and second polymer condenserlayers 71 a and 71 b.

The conductor pattern may be formed by a dry process such as sputtering,or a wet process such as screen printing.

The first and second polymer condenser layers 71 a and 71 b having firstand second conductor patterns 73 a and 73 b, respectively, are alignedand then laminated together. Alternatively, after the first conductorpattern 73 a is formed on the first polymer sheet 72 a, the secondpolymer sheet 72 b is layered on the first conductor pattern 73 a, andthen, the conductor pattern shifted with respect to the first conductorpattern 73 a of the first polymer condenser layer 71 a may be formed onthe second polymer sheet 72 b. In this way, a desired polymer condenserlaminate is obtained.

As is apparent from FIG. 7 a, it can be shown that the predeterminedportion of the first conductor pattern 73 a of the first polymercondenser layer 71 a is omitted in the second conductor pattern 73 b ofthe second polymer condenser layer 71 b when the first polymer condenserlayer 71 a is compared with the second polymer condenser layer 71 b.

The first and second polymer condenser layers 71 a and 71 b shown inFIG. 7 a are relatively shifted with respect to each other andmultilayered, thereby obtaining a polymer condenser laminate 71 having across-section shown in FIG. 7 b. That is, a portion 75 of the polymercondenser laminate 71 shows the conductor pattern uniformly distributedin a thickness direction of the polymer condenser laminate 71, while theother portion 76 of the polymer condenser laminate 71 shows theconductor pattern partially distributed in a thickness direction of thepolymer condenser sheet 71.

Subsequently, via holes 74 are drilled as shown in FIG. 7 c. In FIG. 7d, the via holes 74 are filled by a plating process, and,simultaneously, a circuit pattern 77 is formed. Then, CCLs havingcircuit patterns and insulating layers are sequentially layered on bothsurfaces of the polymer condenser laminate 71 shown in FIG. 7 d, and thePCB including embedded capacitors thereby manufactured.

In this way, capacitors are diversely designed so that variouscapacitance values can be realized in the polymer condenser laminate 71having a limited thickness.

Specifically, capacitance of the capacitor increases in proportion tothe area of electrodes of the capacitor, according to Equation 1. In thepolymer condenser laminate according to the present invention, a flattype capacitor is provided in a folded shape. Thus, if the number ofpolymer condenser layers increases, the same effect as enlarging thearea of electrodes of the flat type capacitor can be manifested, therebyincreasing the capacitance value.

In FIG. 7 b, the portion 75 requiring high capacitance includes thelarger number of polymer condenser layers having conductor patterns, towhich electrodes are connected, to realize the capacitor having highcapacitance. On the other hand, the other portion 76 requiring lowcapacitance has fewer layers having conductor patterns, to obtain thecapacitor having low capacitance.

By adjusting the area of the conductor pattern of the polymer condenserlaminate, the capacitor portion requiring high capacitance is designedto increase the area of the conductor pattern, while the capacitorportion requiring low capacitance is designed to decrease the area ofthe conductor pattern. Thereby, the capacitors having desired values canbe variously designed in the polymer condenser laminate having limitedthickness and area.

FIGS. 8 a and 8 b show cross-sections of a polymer condenser laminateaccording to another embodiment of the present invention.

After the polymer condenser layers formed as in FIG. 7 a aremultilayered, a through hole 84 is formed through a portion having aconductor pattern distributed uniformly in a thickness direction of thesubstrate, and blind via holes 85 and 85′ are formed through a portionhaving a conductor pattern distributed in part to realize a capacitorhaving low capacitance, as shown in FIG. 8 a. The through hole 84 isformed by a laser drilling process, while the blind via holes 85 and 85′are formed by appropriately controlling the intensity of the laseraccording to the desired depth.

In FIG. 8 b, the holes 84, 85 and 85′ are filled by a plating process,and a circuit pattern 86 is formed on the polymer condenser laminate 81.

Then, as in the above embodiments, CCLs having circuit patterns andinsulating layers are sequentially layered on both surfaces of thepolymer condenser laminate 81 shown in FIG. 8 b, thereby obtaining a PCBincluding embedded capacitors.

As described above, the present invention provides a PCB includingembedded capacitors, and a method of manufacturing the same. Accordingto the PCB and the manufacturing method thereof of the presentinvention, the PCB of the present invention has higher capacitancedensity (100 nF/mm² or more), compared to conventional PCBs includingembedded capacitors. Thus, the capacitors having high capacitance, whichhave previously been mounted on the electronic circuit board, can beformed therein.

According to the PCB and the manufacturing method thereof of the presentinvention, the mounting area of the passive components on the PCB can bedrastically decreased, and also, capacitance of the capacitor can becontrolled by the number of polymer layers, as well as areas of thepolymer layer and the electrode layer, compared to conventional methods.Thus, reliable capacitors can be variously designed.

According to the PCB and the manufacturing method thereof of the presentinvention, the capacitors having various capacitance values can beembedded in the PCB having limited thickness.

According to the PCB and the manufacturing method thereof of the presentinvention, the generation of parasitic inductance between capacitors andchips as in conventional embedded capacitor PCBs can be reduced, therebyminimizing errors and deterioration of signals in high speed ICs.

Although the preferred embodiments of the present invention have beendisclosed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and spirit of the inventionas disclosed in the accompanying claims.

1. A method of manufacturing a printed circuit board including embeddedcapacitors, comprising the steps of: forming a polymer condenserlaminate including a plurality of polymer condenser layers, each ofwhich has a polymer sheet having a high dielectric constant and aconductor pattern formed on the polymer sheet; forming a via hole forinterlayer connection through a double sided copper clad laminate and acircuit pattern on the double sided copper clad laminate, to prepare apatterned copper clad laminate; layering the patterned copper cladlaminate on either surface of the polymer condenser laminate; andforming a via hole through the polymer condenser laminate and a circuitpattern on the polymer condenser laminate.
 2. The method as set forth inclaim 1, wherein the forming of the polymer condenser laminate comprisesthe steps of: forming a first conductor pattern on a first polymersheet; layering a second polymer sheet on the first conductor pattern;and forming a second conductor pattern on the second polymer sheet. 3.The method as set forth in claim 1, wherein the forming of the polymercondenser laminate comprises the steps of: preparing a first polymercondenser layer having a first conductor pattern; preparing a secondpolymer condenser layer having a second conductor pattern; and layeringthe second polymer condenser layer on the first polymer condenser layer.4. The method as set forth in claim 1, wherein the forming of the viahole through the polymer condenser laminate and the circuit pattern onthe polymer condenser laminate comprises the steps of: forming the viahole at a predetermined position on the polymer condenser laminate;filling the via hole of the polymer condenser laminate with a conductivematerial; and forming the circuit pattern on the polymer condenserlaminate.
 5. The method as set forth in claim 1, further comprising thesteps of: layering a predetermined number of single sided copper cladlaminates on one surface or both surfaces of the printed circuit board;and forming a via hole through the layered copper clad laminate and acircuit pattern on the layered copper clad laminate.
 6. A method ofmanufacturing a printed circuit board including embedded capacitors,comprising the steps of: forming a polymer condenser laminate includinga plurality of polymer condenser layers, each of which has a polymersheet having a high dielectric constant and a conductor pattern formedon the polymer sheet; forming a via hole through the polymer condenserlaminate; filling the via hole by plating and forming a circuit pattern;forming a via hole through a double sided copper clad laminate and acircuit pattern on the double sided copper clad laminate, to prepare apatterned copper clad laminate; layering an insulating layer on onesurface or both surfaces of the polymer condenser laminate; layering thepatterned copper clad laminate on the insulating layer; forming a viahole for interlayer electrical connection through the printed circuitboard; and filling the via hole by plating and forming a circuit patternon the printed circuit board.
 7. The method as set forth in claim 6,wherein the forming of the polymer condenser laminate comprises thesteps of: forming a first conductor pattern on a first polymer sheet;layering a second polymer sheet on the first conductor pattern; andforming a second conductor pattern on the second polymer sheet.
 8. Themethod as set forth in claim 6, wherein the forming of the polymercondenser laminate comprises the steps of: preparing a first polymercondenser layer having a first conductor pattern; preparing a secondpolymer condenser layer having a second conductor pattern; and layeringthe second polymer condenser layer on the first polymer condenser layer.9. The method as set forth in claim 6, wherein the forming of the viahole through the polymer condenser laminate and the circuit pattern onthe polymer condenser laminate comprises the steps of: forming the viahole at a predetermined position on the polymer condenser laminate;filling the via hole of the polymer condenser laminate with a conductivematerial; and forming the circuit pattern on the polymer condenserlaminate.
 10. The method as set forth in claim 6, further comprising thesteps of: preparing another patterned copper clad laminate having a viahole and a circuit pattern; layering an insulating layer on one surfaceor both surfaces of the printed circuit board; layering the patternedcopper clad laminate on the insulating layer; forming a through hole forinterlayer connection through the layered copper clad laminate; andfilling the through hole with a conductive material.
 11. A printedcircuit board including embedded capacitors, comprising the steps of: apolymer condenser laminate including a plurality of polymer condenserlayers, each of which has a polymer sheet and a conductor pattern formedon the polymer sheet, and a via hole for interlayer connectiontherethrough; and a circuit layer formed on at least one surface of thepolymer condenser laminate, and having a circuit pattern and a via holefor interlayer connection therethrough.
 12. The method as set forth inclaim 11, wherein the polymer condenser laminate further comprises a viahole for connection to an external power line or ground linetherethrough.
 13. The method as set forth in claim 11, wherein theconductor patterns of the plurality of polymer condenser layers arerelatively shifted with respect to each other.
 14. The method as setforth in claim 11, wherein the conductor patterns of the plurality ofpolymer condenser layers are different with respect to each other.